Thermal Performance of Microchannels Heat Sink with Fins on side walls

The main objective of this study is to investigate the thermal performance of straight microchannel heat sinks with fins on sidewalls. A mathematical model is developed and used to carry out the simulation-based study to examine the performance of the microchannel heat sink. From the CFD study, numerical results are obtained for different operational and geometrical conditions. The study shows that using a straight microchannel with pin fins on side walls is better at lower ranges of Reynolds number lower than 400; however, at Reynolds number higher than 400 the straight microchannel with smooth sidewalls shows better performance. Moreover, at a higher Reynolds number than 800, the pressure drop increases significantly. Furthermore, increasing the size of pin fins for both triangle and square fins enhances thermal resistance but also leads to higher pressure drop.