Performance Optimization of a 3 GHz Double Inset Fed Microstrip Patch Antenna for Advanced Wireless Systems

Wireless technologies are changing so fast that highly efficient, compact and economic radiating elements become a necessity. The demands of these technologies are ideally met by microstrip patch antennas (MPAs) for their planar structure and ease of integration. This paper presents the design and optimization of a double inset-feed technique for designing an MPA, which is applied for a modern wireless communication of resonant frequency 3 GHz. The FR-4 substrate is 1.3 mm thick and the conductive layers are made of copper. The parametric sweeps of the inset feed dimensions resulted in a remarkably low return loss of -31.605 dB and an almost perfect Voltage Standing Wave Ratio (VSWR) of 1.05 at the frequency of 3.061 GHz. Furthermore, it was also observed that there is a significant impedance bandwidth of 2.158 GHz at cut off frequency of 3.058 GHz. The comparative study indicates that the proposed design has better impedance matching and bandwidth compared to the existing work. Therefore it is an excellent design for 4G, 5G, Internet of Things (IoT) infrastructure and radar system.